PACK EXPO International has become one of the largest events for the packaging and processing industry, a key segment of the manufacturing sector.
The 2024 edition of the show, set to take place November 3-6 at McCormick Place in Chicago, IL, is expected to be the largest yet according to show producer PMMI, The Association for Packaging and Processing Technologies. Over 2,500 exhibitors across 1.3 million net sq. ft. will be on hand to highlight their latest products and services. And more than 45,000 attendees from around the world are expected.
PMMI stated in a press release announcing the opening of registration earlier in the year that it is a growing industry in which a number of technological advancements are taking place. Sustainability, automation and artificial intelligence (AI) are chief among them, similar to many other industries.
A recent report from market intelligence firm Interact Analysis showed the packaging machinery industry is one of the few bright spots in the manufacturing industry for 2024 and is expected to see continued growth due in part to technological developments being made.
Fluid power (especially pneumatics) and electromechanical motion control components are key to the performance of many packaging machines, making PACK EXPO International an event to watch for the technologies and trends impacting this sector.
Following are further details about the 2024 event as well as some of the technologies scheduled to be on display which are most relevant to the fluid power and electromechanical motion control industry.
Sustainability, Education to be Key Highlights of PACK EXPO 2024
In addition to the many technologies that will be on display, PACK EXPO will feature several educational opportunities as well. Over 150 educational sessions are planned which will take place right on the show floor covering current technologies and trends influencing the packaging and processing industry.
Per PMMI, these opportunities will include:
- Three innovation stages where 30-minute seminars will offer insight on breakthrough technologies and techniques focused on a wide range of industry-specific solutions.
- The Processing Innovation Stage will focus on the latest food and beverage processing breakthroughs, including food safety, high-pressure pasteurization, sustainability, cleaning, and more.
- At Industry Speaks, experts from the PACK EXPO International Partner Program, covering multiple industry verticals, address the latest hot topics and industry trends such as sustainability, remote access, supply chain solutions, augmented reality, and operational efficiency.
Several opportunities for students will be featured as well including a Future Innovators Robotics Showcase where students from Chicago-area high school robotics teams will highlight their design, engineering and troubleshooting skills.
New for the 2024 show will be Sustainability Central, located in the West Hall, where educational sessions and displays will demonstrate ways to reduce one’s environmental footprint through manufacturing, materials, logistics, design and more. PMMI said sustainability will be a key theme of the show due to growing interest from consumers, regulators and manufacturers.
READ MORE: The Rising Influence of Sustainability on Hydraulics and Pneumatics
A PACK EXPO Green icon can be found throughout the show to easily identify those who are exhibiting sustainable materials, machines and services. The logo will also be used to indicate educational sessions on the topic.
Bosch Rexroth Displaying Complete Factory Automation Solutions
In addition to various product technologies, Bosch Rexroth is displaying complete factory automation solutions for consumer packaged goods (CPG) at PACK EXPO 2024.
Several demos will be set up at the company’s booth to show attendees how its technologies can be utilized in various scenarios and when they are put together into a full system solution. This will include a multi-tech collaborative palletizing demo consisting of Bosch Rexroth’s aluminum structural framing, VarioFlow plus conveyor system – a modular plastic chain conveyor that allows for safe and reliable goods transport – and a Kassow 7-axes collaborative robot.
Other demos at the company’s booth will be focused on specific products, such as the new linear motor modules designed to be fast, compact and precise. They are available in sizes 140, 180 and 220 mm, feature a zero-backlash direct drive and complement the existing Bosch Rexroth linear motion technology portfolio.
Another demo will highlight the ctrlX AUTOMATION platform, showing how it can support various applications and network languages to fit individual customer requirements.
Emerson to Exhibit Latest Pneumatic Components
Emerson will show a range of technologies at its PACK EXPO booth, including its most recent pneumatic component developments, many of which are designed to provide improved energy efficiency and automation capabilities in packaging and processing applications.
Among them is the next-generation AVENTICS Series XV Pneumatic Valves designed to provide optimized flow for packaging lines and increased automation flexibility. The Series XV valves feature multiple interoperable valve sizes, higher flow rates, a compact design and support for leading fieldbus protocols to simplify integration into machine control networks.
The company’s AF2 Flow Sensors will also be on display, which help to improve energy efficiency by monitoring air consumption in pneumatic systems. If a leak is detected, an alert is provided so action can be taken to fix it, optimizing energy use and preventing potential machine downtime.
READ MORE about the AVENTICS Series AF2 Flow Sensors.
Another technology on display will be a pneumatic valve system with integrated Open Platform Communications Unified Architecture (OPC UA). This technology helps interoperability challenges and accesses data more easily, while the digital twin integration improves productivity efficiency and reduces costs, according to Emerson.
Other technologies on display include Emerson’s SPRA electric rod-style linear actuators, edge devices and an electronic fieldbus valve system capable of replacing hard-wired solutions by integrating communication interfaces with pneumatic valve systems that have input/output (I/O) capabilities.
Festo Introducing New Pneumatic Valve Terminal
At PACK EXPO 2024, Festo will feature several of its electric and pneumatic technologies including its new VTUX valve terminal.
The valve terminal is compact and lightweight, aiding use for end-of-arm tooling robotics as well as other space-constrained applications. It can serve as I/O, remote I/O, and decentralized I/O, and be located anywhere on a machine to aid performance of pneumatic valves.
Another highlight of Festo's exhibit will be a 12-cycle-per-minute case packer for food and beverage companies. Developed by CODI Manufacturing, the machine was designed and built in 4 weeks utilizing Festo engineering tools. A Festo two-axis handling system is utilized on the machine which the company assembled and shipped as a bolt-in-ready system, helping to reduce build and commissioning time for CODI Manufacturing.
Additional technologies on display at Festo's PACK EXPO booth include:
- ELGD next-generation electric automation axes
- new OVPN and OASP multistage vacuum generators
- simplified electric motion (SMS) actuators comparable to the ease-of-use and competitive cost of pneumatics
- controlled pneumatics which provide similar capabilities to electric servo control.
Per the company, machine automation typically involves use of both electric and pneumatic systems which Festo will demonstrate through its new booth design highlighting these systems.
Oxipital AI Demonstrating AI Vision Technologies
Oxipital AI, a developer of artificial intelligence (AI) enabled machine vision technologies, will demonstrate the capabilities of its systems for robotic process automation and product inspection at PACK EXPO 2024.
Among the vision technologies on display will be the company's new VX2 Vision System for inspection and high-speed picking applications. Based on Oxipital's Visual AI platform, it offers a compact design capable of providing enhanced inspection, high-speed picking as well as combination of the two for use in food grade and industrial applications.
The company has also partnered with Schmalz, a developer of vacuum technologies, to demonstrate vision-guided robotics picking at the show. For the demo, Schmalz's food-grade flexible robotic grippers have been paired with Oxipital's AI-enabled vision technology for high-speed conveyor picking, orienting, and tray-packing chicken drumsticks.
Oxipital AI's Director of Business Development Jonathan Weiss will also present “Enhancing Manufacturing with AI-Powered Vision Technology: Optimizing Quality and Efficiency” at Pack Expo's Emerging Brands Summit on Tuesday, Nov. 5, at 12:30 p.m. CT during which he will discuss how visual AI benefits inspection and vision-guided robot applications in the food processing and consumer packaged goods industries.
READ MORE: Give Automation a Lift with Vacuum Systems
Rockwell Automation Showing Connected Enterprise Technologies
Rockwell Automation plans to demonstrate a complete Connected Enterprise which brings together plant-level and enterprise networks to connect people, processes, and technologies at PACK EXPO 2024.
Machines and digital technologies are combined in this Connected Enterprise to provide better access and analysis of data to optimize production and overall operations. Interactive demos at the company’s booth will highlight various technologies including:
- Industrial AI (artificial intelligence) which can be seen in products from the company such as FactoryTalk Analytics LogixAI for filling accuracy, as well as FactoryTalk Design Studio Copilot that uses Generative AI to process natural language to create PLC code technologies.
- DataReady smart machines which provide customers with machine insights through Rockwell’s FactoryTalk Optix and Plex Asset Performance Management.
- Intelligent material movement via autonomous mobile robots (AMRs) and software from OTTO by Rockwell Automation. At the show there will be a live demonstration of OTTO 100, the smallest AMR capable of moving payloads up to 150 kg (331 lbs.); OTTO 100 will be equipped with a staging cart and autonomously deliver snacks to attendees.
- Digital engineering capabilities shown through a virtual reality experience, powered by Emulate3D software. Attendees will have the chance to experience being the human element in a semi-automated packaging operation and explore diverse use cases and success stories.
READ MORE: Rockwell Acquisition of Clearpath Robotics Demonstrates Growth of Mobile Robots
The company will also have a separate OEM technology showcase room where its ArmorKinetix Distributed Servo Drives and iTRAK Independent Cart Technology will be on display. Rockwell will offer its expertise during educational sessions held on the Innovation State on topics including new capacity design, real-life applications for industrial AI and the role AMR can play in improving worker safety.
SOMIC Packaging to Highlight Latest Packaging Machinery
SOMIC Packaging Inc., a developer of packaging machines, is exhibiting its next generation SOMIC 434 automated packaging system at the 2024 edition of PACK EXPO.
The 434 system is designed to handle up to 34 cases per minute during a single cycle, and is capable of packing flat sachets, stand-up flexible pouches, as well as a wide array of cans, cups, trays, jars, bottles, tubes and blister-packs.
Decentralized servo technology aids the machine’s modular design and functional units can be individually adapted for any customer requirements and future applications, notes the company. In addition, SOMIC has chosen noise-intensive components to reduce sound levels and thus improve the operator experience.
The machine will be demonstrated at PACK EXPO, providing attendees with a first-hand look at its capabilities. As it has already been sold to a multinational cheese packager, cheese products will be run through the machine during show demos to show how it can be used for such an application.
