Master Bond Supreme 70CN

Key Features

  • Moderate viscosity
  • Superior chemical resistance
  • Black-colored, optically opaque
  • NASA low outgassing

Master Bond Supreme 70CN is a moderate viscosity, toughened epoxy for high-performance bonding, sealing, coating, and potting. The mix ratio is a forgiving 100 to 30 by weight with a user-friendly working time of 60-90 minutes. It cures readily at ambient temperatures and more rapidly at elevated temperatures. An optimum curing schedule is overnight at room temperature followed by 4-5 hours at 140-170°F. Supreme 70CN does not contain any solvents or diluents and has low shrinkage upon curing. It should be noted that this epoxy has exceptional wetting properties.

Supreme 70CN is an excellent adhesive and bonds well to a wide variety of substrates including metals, ceramics, and many rubbers, plastic materials, and especially composites. An important feature is its toughness, which allows it to be used for bonding dissimilar substrates and to withstand thermal cycling. Other favorable attributes include good physical strength and excellent chemical resistance.

It is a reliable electrical insulator, which combined with its lower exotherm, enables it to be utilized in a wide array of potting applications. The service temperature range is -150°F to +400°F. The color of Part A is black and Part B is light orange. This multi-faceted system can be considered for applications in aerospace, electronic, opto-electronic, and specialty type OEM, particularly those involving composites and fibers.

Product Advantages

  • Moderate viscosity and longer open time
  • Fine physical strength properties
  • Toughened system; resists thermal cycling
  • Outstanding chemical resistance
  • Superior low-temperature serviceability

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.